Professional English in Semiconductor

Words

Words	Translation
die	芯片
wafer	晶圆
substrate	基板
baseplate	底板
encapsulation	封装，塑装
plate	电镀
epitaxy	外延`Epi`
bump	凸点
voids	空洞`microns`
Lids	金属罩
etch	刻蚀 `激光刻蚀 laser etching`
coplanar	共面
coplanirity	共面性
mount	贴装 `solderball mount`
attach	贴装`die attach`
assembly	装配
soldering	焊接
sintering	烧结
deposition	沉积
pitch	间距
Warpage	翘曲、弯曲
plasma	等离子体
polyimide	聚酰亚胺
epoxy	环氧树脂
silicone gel	硅胶
mechanism	机制
corrosion	腐蚀
alloy	合金
particle	粒子
shear strength	剪切力
Fab	alt. foundry factory
Fabless	Fab + Fabless = complete chip flow
intermetallics`IMs`	金属间化合物
eutectic	共晶
porosity	孔隙`NANO - micron`
delamination	分层
phosphors	荧光粉
wear-out	疲劳、磨损
catastrophic failure	突然失效
empirical	经验性的
atomic molecular	原子分子

Abreviation	Full-name	Translation
SBM	Solder Ball Mount	焊球贴装
UBM	Under Ball Material	球下金属
TIM	Thermal Interface Material	热表面材料
LIS	Lead Inspection	引脚检测
BGA	Ball Grid Array	球栅阵列
FcBGA	Flip Chip Ball Grid Array	倒装球栅阵列
GPU	Graphics Processing Unit	图形处理单元
ELK	Extreme Low-k Dielectric	超低介电系数
DBC	Direct Bonded Copper	覆铜板 `substrate`
DBA	Direct Bonded Aluminum	覆铝板 `substrate`
DP	Die Preparation	DS `Die Sawing`
PCB	Printed Circuit Board	印刷电路板
LD	lead	引脚`lead free 不含铅的`
TLP	Transient Liquid Phase Bonding	瞬间液相键合
SLID	Solid Liquid Interdiffusion Bonding	固液互扩散键合
CTE	Coefficient of Thermal Expansion	热膨胀系数
ASIC	Application-Specific Integrated Circuit	专用集成电路
FPGA	Filed Programmable Gate Array	可编程门阵列
SoC	System on Chip
MEMS	Micro Electronic Mechanical System	微机电系统
OSAT	Out Sourced Assembly and Test	外包封测
IDM	Integrated Design Automation	集成设计自动化
LTJT	Low Temperature Joining Technology	低温连接技术
RDL	Redistribution Layer	重构线层
SEM	Scanning Electron Microscope	扫描电镜
IMS	Insulated Metal Substrate	绝缘金属基板
DfR	Design for Reliability	可靠性设计
FE	Finite Element	有限元
DOE	Design Of Experiment	实验设计
EMC	Epoxy Molding Compound	环氧塑膜料