{"id":78,"date":"2024-02-27T19:06:18","date_gmt":"2024-02-27T11:06:18","guid":{"rendered":"http:\/\/www.pnjie.top\/?p=78"},"modified":"2024-03-18T22:23:14","modified_gmt":"2024-03-18T14:23:14","slug":"semiconductortypicalwords","status":"publish","type":"post","link":"https:\/\/www.pnjie.top\/?p=78","title":{"rendered":"\u534a\u5bfc\u4f53\u884c\u4e1a\u5e38\u7528\u5355\u8bcd\u548c\u7f29\u5199"},"content":{"rendered":"\n

Professional English in Semiconductor<\/h1>\n\n\n

Words<\/h2>\n\n\n
Words<\/th>Translation<\/th><\/tr><\/thead>
die<\/td>\u82af\u7247<\/td><\/tr>
wafer<\/td>\u6676\u5706<\/td><\/tr>
substrate<\/td>\u57fa\u677f<\/td><\/tr>
baseplate<\/td>\u5e95\u677f<\/td><\/tr>
encapsulation<\/td>\u5c01\u88c5\uff0c\u5851\u88c5<\/td><\/tr>
plate<\/td>\u7535\u9540<\/td><\/tr>
epitaxy<\/td>\u5916\u5ef6Epi<\/code><\/td><\/tr>
bump<\/td>\u51f8\u70b9<\/td><\/tr>
voids<\/td>\u7a7a\u6d1emicrons<\/code><\/td><\/tr>
Lids<\/td>\u91d1\u5c5e\u7f69<\/td><\/tr>
etch<\/td>\u523b\u8680 \u6fc0\u5149\u523b\u8680 laser etching<\/code><\/td><\/tr>
coplanar<\/td>\u5171\u9762<\/td><\/tr>
coplanirity<\/td>\u5171\u9762\u6027<\/td><\/tr>
mount<\/td>\u8d34\u88c5 solderball mount<\/code><\/td><\/tr>
attach<\/td>\u8d34\u88c5die attach<\/code><\/td><\/tr>
assembly<\/td>\u88c5\u914d<\/td><\/tr>
soldering<\/td>\u710a\u63a5<\/td><\/tr>
sintering<\/td>\u70e7\u7ed3<\/td><\/tr>
deposition<\/td>\u6c89\u79ef<\/td><\/tr>
pitch<\/td>\u95f4\u8ddd<\/td><\/tr>
Warpage<\/td>\u7fd8\u66f2\u3001\u5f2f\u66f2<\/td><\/tr>
plasma<\/td>\u7b49\u79bb\u5b50\u4f53<\/td><\/tr>
polyimide<\/td>\u805a\u9170\u4e9a\u80fa<\/td><\/tr>
epoxy<\/td>\u73af\u6c27\u6811\u8102<\/td><\/tr>
silicone gel<\/td>\u7845\u80f6<\/td><\/tr>
mechanism<\/td>\u673a\u5236<\/td><\/tr>
corrosion<\/td>\u8150\u8680<\/td><\/tr>
alloy<\/td>\u5408\u91d1<\/td><\/tr>
particle<\/td>\u7c92\u5b50<\/td><\/tr>
shear strength<\/td>\u526a\u5207\u529b<\/td><\/tr>
Fab<\/td>alt. foundry factory<\/td><\/tr>
Fabless<\/td>Fab + Fabless = complete chip flow<\/td><\/tr>
intermetallicsIMs<\/code><\/td>\u91d1\u5c5e\u95f4\u5316\u5408\u7269<\/td><\/tr>
eutectic<\/td>\u5171\u6676<\/td><\/tr>
porosity<\/td>\u5b54\u9699NANO - micron<\/code><\/td><\/tr>
delamination<\/td>\u5206\u5c42<\/td><\/tr>
phosphors<\/td>\u8367\u5149\u7c89<\/td><\/tr>
wear-out<\/td>\u75b2\u52b3\u3001\u78e8\u635f<\/td><\/tr>
catastrophic failure<\/td>\u7a81\u7136\u5931\u6548<\/td><\/tr>
empirical<\/td>\u7ecf\u9a8c\u6027\u7684<\/td><\/tr>
atomic molecular<\/td>\u539f\u5b50 \u5206\u5b50<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n
\n\n\n

Abridge<\/h2>\n\n\n
Abreviation<\/th>Full-name<\/th>Translation<\/th><\/tr><\/thead>
SBM<\/td>Solder Ball Mount<\/td>\u710a\u7403\u8d34\u88c5<\/td><\/tr>
UBM<\/td>Under Ball Material<\/td>\u7403\u4e0b\u91d1\u5c5e<\/td><\/tr>
TIM<\/td>Thermal Interface Material<\/td>\u70ed\u8868\u9762\u6750\u6599<\/td><\/tr>
LIS<\/td>Lead Inspection<\/td>\u5f15\u811a\u68c0\u6d4b<\/td><\/tr>
BGA<\/td>Ball Grid Array<\/td>\u7403\u6805\u9635\u5217<\/td><\/tr>
FcBGA<\/td>Flip Chip Ball Grid Array<\/td>\u5012\u88c5\u7403\u6805\u9635\u5217<\/td><\/tr>
GPU<\/td>Graphics Processing Unit<\/td>\u56fe\u5f62\u5904\u7406\u5355\u5143<\/td><\/tr>
ELK<\/td>Extreme Low-k Dielectric<\/td>\u8d85\u4f4e\u4ecb\u7535\u7cfb\u6570<\/td><\/tr>
DBC<\/td>Direct Bonded Copper<\/td>\u8986\u94dc\u677f substrate<\/code><\/td><\/tr>
DBA<\/td>Direct Bonded Aluminum<\/td>\u8986\u94dd\u677f substrate<\/code><\/td><\/tr>
DP<\/td>Die Preparation<\/td>DS Die Sawing<\/code><\/td><\/tr>
PCB<\/td>Printed Circuit Board<\/td>\u5370\u5237\u7535\u8def\u677f<\/td><\/tr>
LD<\/td>lead<\/td>\u5f15\u811alead free \u4e0d\u542b\u94c5\u7684<\/code><\/td><\/tr>
TLP<\/td>Transient Liquid Phase Bonding<\/td>\u77ac\u95f4\u6db2\u76f8\u952e\u5408<\/td><\/tr>
SLID<\/td>Solid Liquid Interdiffusion Bonding<\/td>\u56fa\u6db2\u4e92\u6269\u6563\u952e\u5408<\/td><\/tr>
CTE<\/td>Coefficient of Thermal Expansion<\/td>\u70ed\u81a8\u80c0\u7cfb\u6570<\/td><\/tr>
ASIC<\/td>Application-Specific Integrated Circuit<\/td>\u4e13\u7528\u96c6\u6210\u7535\u8def<\/td><\/tr>
FPGA<\/td>Filed Programmable Gate Array<\/td>\u53ef\u7f16\u7a0b\u95e8\u9635\u5217<\/td><\/tr>
SoC<\/td>System on Chip<\/td><\/td><\/tr>
MEMS<\/td>Micro Electronic Mechanical System<\/td>\u5fae\u673a\u7535\u7cfb\u7edf<\/td><\/tr>
OSAT<\/td>Out Sourced Assembly and Test<\/td>\u5916\u5305\u5c01\u6d4b<\/td><\/tr>
IDM<\/td>Integrated Design Automation<\/td>\u96c6\u6210\u8bbe\u8ba1\u81ea\u52a8\u5316<\/td><\/tr>
LTJT<\/td>Low Temperature Joining Technology<\/td>\u4f4e\u6e29\u8fde\u63a5\u6280\u672f<\/td><\/tr>
RDL<\/td>Redistribution Layer<\/td>\u91cd\u6784\u7ebf\u5c42<\/td><\/tr>
SEM<\/td>Scanning Electron Microscope<\/td>\u626b\u63cf\u7535\u955c<\/td><\/tr>
IMS<\/td>Insulated Metal Substrate<\/td>\u7edd\u7f18\u91d1\u5c5e\u57fa\u677f<\/td><\/tr>
DfR<\/td>Design for Reliability<\/td>\u53ef\u9760\u6027\u8bbe\u8ba1<\/td><\/tr>
FE<\/td>Finite Element<\/td>\u6709\u9650\u5143<\/td><\/tr>
DOE<\/td>Design Of Experiment<\/td>\u5b9e\u9a8c\u8bbe\u8ba1<\/td><\/tr>
EMC<\/td>Epoxy Molding Compound<\/td>\u73af\u6c27\u5851\u819c\u6599<\/td><\/tr><\/tbody><\/table><\/figure>\n","protected":false},"excerpt":{"rendered":"

\u603b\u7ed3\u4e86\u4e00\u4e9b\u5e38\u7528\u7684\u534a\u5bfc\u4f53\u884c\u4e1a\u82f1\u6587\u548c\u7f29\u5199<\/p>\n","protected":false},"author":1,"featured_media":217,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[6],"tags":[30,29,26],"class_list":["post-78","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-basiclearning","tag-english","tag-semiconductor","tag-26"],"_links":{"self":[{"href":"https:\/\/www.pnjie.top\/index.php?rest_route=\/wp\/v2\/posts\/78","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.pnjie.top\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.pnjie.top\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.pnjie.top\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.pnjie.top\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=78"}],"version-history":[{"count":3,"href":"https:\/\/www.pnjie.top\/index.php?rest_route=\/wp\/v2\/posts\/78\/revisions"}],"predecessor-version":[{"id":214,"href":"https:\/\/www.pnjie.top\/index.php?rest_route=\/wp\/v2\/posts\/78\/revisions\/214"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.pnjie.top\/index.php?rest_route=\/wp\/v2\/media\/217"}],"wp:attachment":[{"href":"https:\/\/www.pnjie.top\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=78"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.pnjie.top\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=78"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.pnjie.top\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=78"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}